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ESD Anti Static Semiconductor Waffle Chip Trays

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ESD Anti Static Semiconductor Waffle Chip Trays

Model Number : HN24171

Color : Black

Mold Type : Injection

Tray Shape : Rectangular

Certification : ROHS, ISO

Capacity : 6x7=42 PCS

Ic Type : BGA,QFP,QFN,LGA,PGA

Place of Origin : China

Payment Terms : T/T

MOQ : 1000

Packaging Details : CARTON, PALLET

Brand Name : Hiner-pack

Outline Line Size : 50.8×50.8×3.94 mm

Reusable : Yes

Delivery Time : 10 workdays

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Clean Class : General And Ultrasonic Cleaning

Cavity Size : 4.64x4.22x0.755 mm

Packing Level : Transport package

Warpage : Warpage MAX 0.2mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Supply Ability : 2000PCS/Day

Quality Assurance : Delivery Guarantee, Reliable Quality

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

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ESD Anti Static Semiconductor Waffle Chip Trays

Provide stable anti-static protection for semiconductor IC chips. Bear 125℃ high-temperature working environment. Adopt precise cross-type waffle structure to fix chips firmly and avoid collision damage. Meet strict electronic packaging industry standards. Need reliable chip storage solutions for electronic manufacturing?


Apply to semiconductor packaging testing links. Serve IC die sorting, wafer packaging and chip transportation storage scenarios. Fit integrated circuit component processing and electronic factory production lines perfectly.


Support electronic component turnover and vacuum packaging applications. Offer full custom waffle structure, cavity size and material modification services. Realize personalized tray design according to different chip models and customer requirements. Become your exclusive semiconductor packaging storage partner.

Key Features/ Benefits
  • Deliver effective ESD anti-static performance
  • Stable high-temperature resistance up to 125℃
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24171
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 4.64x4.22x0.755 mm
Matrix QTY 6x7=42 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor packaging, IC chip testing and die sorting processes. Fit wafer processing and electronic component packaging production links perfectly.


Serve chip turnover storage, vacuum packaging and transportation scenarios. Adapt to various integrated circuit manufacturing and electronic assembly industries.

Packaging & Shipping/ Services
Adopt safe anti-pressure outer packaging to protect internal waffle trays. Provide shockproof and dustproof packaging for long-distance transportation. Support customized packaging specifications according to order quantity. Ensure intact tray delivery and stable anti-static performance during logistics.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

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