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Durable Dense Cavity Waffle Pack IC Handling Trays

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Durable Dense Cavity Waffle Pack IC Handling Trays

Quality Assurance : Delivery Guarantee, Reliable Quality

MOQ : 1000

Ic Type : BGA,QFP,QFN,LGA,PGA

Outline Line Size : 50.8×50.8×6.2 mm

Cavity Size : 1.35x1.30x1.0 mm

Supply Ability : 2000PCS/Day

Color : Black

Clean Class : General And Ultrasonic Cleaning

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Warpage : Warpage MAX 0.26mm

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Packaging Details : CARTON, PALLET

Capacity : 10x10=100 PCS

Payment Terms : T/T

Mold Type : Injection

Tray Shape : Rectangular

Packing Level : Transport package

Brand Name : Hiner-pack

Model Number : HN24168

Place of Origin : China

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Reusable : Yes

Certification : ROHS, ISO

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Durable Dense Cavity Waffle Pack IC Handling Trays

Dense cavity JEDEC waffle pack trays meet strict international semiconductor cleanroom standards. Delivers stable particulate contamination isolation and professional ESD anti-static performance, fully protecting fragile fine pitch integrated circuit components from production damage.


Features uniform precise dense square cavity grid structure. Owns durable interlocking stackable design, effectively resists dust pollution, scratch damage and electrostatic interference through all chip handling and transfer procedures.


Covers full semiconductor packaging, inspection, testing, logistics transportation and inventory storage scenarios. Maintains long-term clean and stable status for sensitive high-value IC chips. Supports fully customized pocket cavity specifications for diversified chip models.

Key Features/ Benefits
  • Anti-static & dust-proof design for safe chip handling
  • Offers stable cleanroom-grade contamination control
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24168
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×6.2 mm
Cavity Size 1.35x1.30x1.0 mm
Matrix QTY 10x10=100 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Cleanroom-grade Waffle Pack IC Trays provide full protection for semiconductor chips with contamination control & ESD anti-static performance.
  • Fine pitch IC packaging (QFN, BGA, CSP bare die)
  • JEDEC compatible automated pick-and-place lines
  • Semiconductor inspection & testing processes
  • Cleanroom IC logistics transportation & storage management
Packaging & Shipping/ Services
Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

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Wholesale Durable Dense Cavity Waffle Pack IC Handling Trays from china suppliers

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